Pearl Agyakwa

Contact

• workRoom 511 Tower Building
  University Park
  Nottingham
  NG7 2RD
  UK
• work01158466890
• pearl.agyakwa@nottingham.ac.uk

Biography

Pearl obtained her first degree in materials science from Brunel University, UK, in 1999 and a PhD in metallurgy from the University of Nottingham, UK in 2004. She has held a number of university posts since then, including one at the Advanced Manufacturing Research Centre with Boeing in Sheffield, UK, working on applied research projects for the benefit of industrial partners within the aerospace sector. She currently holds a research fellowship at the Department of Electrical and Electronic Engineering at the University of Nottingham, UK, within a multidisciplinary team of researchers studying various elements of power electronics packaging. Her role focuses on the materials science aspects of interconnect reliability.

Recent Publications

• AGYAKWA, PA, CORFIELD, MR, YANG, L, LI, JF, MARQUES, VMF and JOHNSON, CM, 2011. Microstructural Evolution Of Ultrasonically Bonded High Purity Al Wire During Extended Range Thermal Cycling Microelectronics Reliability. 51(2), 406-415
• LI, JF, AGYAKWA, PA and JOHNSON, CM, 2011. Interfacial Reaction In Cu/Sn/Cu System During The Transient Liquid Phase Soldering Process Acta Materialia. 59(3), 1198-1211
• CASTELLAZZI, A., SOLOMON, A., AGYAKWA, P., LI, J., TRENTIN, A. and JOHNSON, C. M., 2010. High power density, low stray inductance, double sided cooled matrix-converter type switch In: 2010 International Power Electronics Conference (IPEC).
• AGYAKWA, P., CORFIELD, M., LI, J., JOHNSON, C., HOGG, S., LIOTTI, E. and LOH, W., 2010. Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling IEEE Transactions on Device and Materials Reliability.

• View all publications

• AGYAKWA, PA, CORFIELD, MR, YANG, L, LI, JF, MARQUES, VMF and JOHNSON, CM, 2011. Microstructural Evolution Of Ultrasonically Bonded High Purity Al Wire During Extended Range Thermal Cycling Microelectronics Reliability. 51(2), 406-415
• LI, JF, AGYAKWA, PA and JOHNSON, CM, 2011. Interfacial Reaction In Cu/Sn/Cu System During The Transient Liquid Phase Soldering Process Acta Materialia. 59(3), 1198-1211
• CASTELLAZZI, A., SOLOMON, A., AGYAKWA, P., LI, J., TRENTIN, A. and JOHNSON, C. M., 2010. High power density, low stray inductance, double sided cooled matrix-converter type switch In: 2010 International Power Electronics Conference (IPEC).
• AGYAKWA, P., CORFIELD, M., LI, J., JOHNSON, C., HOGG, S., LIOTTI, E. and LOH, W., 2010. Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling IEEE Transactions on Device and Materials Reliability.
• MATTEY, N., SKURIAT, R., LI, J., AGYAKWA, P., EVANS, P. and JOHNSON, C.M., 2010. Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module In: Electronic System-Integration Technology Conference (ESTC), 13-16 Sept. 2010.
• LI, JF, AGYAKWA, PA, JOHNSON, CM, ZHANG, D, HUSSAIN, T and MCCARTNEY, DG, 2010. Characterization And Solderability Of Cold Sprayed Sn-Cu Coatings On Al And Cu Substrates Surface & Coatings Technology. 204(9-10), 1395-1404
• SOLOMON, A., CASTELLAZZI, A., HOYLAND, R., AGYAKWA, P., JIANFENG LI and JOHNSON, C.M., 2009. A highly integrated high-voltage bi-directional switch In: ISDRS '09. International Semiconductor Device Research Symposium, 2009..
• HUA LU, RIDOUT, S., BAILEY, C., WEI SUN LOH, AGYAKWA, P. and JOHNSON, M., 2008. Computer simulation of crack propagation in power electronics module solder joints In: Electronic Packaging Technology & High Density Packaging, 28-31 July 2008.
• 2003. In: ANISOTROPIC BEHAVIOUR OF DAMAGED MATERIALS: Anisotropic creep and fracture behaviour of a 9CrMoNbV weld metal at 650 degrees C 9. 295-316